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Expert electronic components information details? Nowadays, Wi-Fi devices are ubiquitous in our lives. Casually open the home wireless routing management interface, there may be no less than 10 Wi-Fi devices online at the same time. The increase in the number of devices leads to network congestion, performance degradation, increased delay and other problems. These problems became more serious in the era of Wi-Fi 5 (802.11 ac). Therefore, when designing Wi-Fi 6 (802.11 ax), experts made improvements and innovations specifically for the problem of network congestion. So, what new technologies does Wi-Fi 6 use to improve wireless channel capacity? When the user equipment receives the AP signal, it will compare whether the color it receives is consistent with the current associated AP color. When the color is the same, the user will think that the signal is the signal in the cell. If the color of the received signal is different from that of the associated AP, the user determines that the signal belongs to the interference signal. As shown in the following figure, due to the use of different color codes, the channel 1 of the green cell is no longer interfered by the adjacent cell channel 1 (blue and red). Read extra information on grm185r61c475ke11d.

From the perspective of automakers, semiconductors will not be enough until 2024,” read next to the big news in the April 30 edition of the Nikkei News. In this article, Intel CEO Pat Gelsinger said at its financial results conference on April 28 that “due to capacity and production equipment constraints, semiconductor shortages will last until at least 2024. How long will this shortage of semiconductors last? I began to think that, as Intel’s chief executive said, “at least until 2024”, the semiconductor shortage will not disappear, and the semiconductor shortage will last for a long time. In this article, I would like to discuss the basic principles. If we come to a conclusion first, we speculate that there will be a long-term shortage of traditional analog and power semiconductors in the future due to the following reasons.

The basic content of SoC definition is mainly in two aspects: one is its composition, and the other is its formation process. The composition of the system-level chip can be a system-level chip control logic module, a microprocessor/microcontroller CPU core module, a digital signal processor DSP module, an embedded memory module, and an interface module for external communication, and an ADC/DAC module. Analog front-end modules, power supply, and power management modules, for a wireless SoC there are also RF front-end modules, user-defined logic (which can be implemented by FPGA or ASIC), and micro-electromechanical modules, and more importantly, an SoC chip with embedded Basic software (RDOS or COS and other application software) modules or loadable user software, etc. The system-on-chip formation or generation process includes the following three aspects.

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